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Thursday, September 9, 2010
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JULY 2010 CONTENTS
Contents
July 2010
 
 
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Cover Story

Reflow technology: Convection versus condensation
EM Asia Comment

China’s next manufacturing move
Features

Optimizing electronics production through key performance indicators

Limitations of DI-water cleaning processes
Viewpoint

Tom Forsythe, Vice President and Director of Kyzen, discusses the company’s focus on continuous improvement and the importance of environmentally-conscious cleaning chemistries.

Tetsuro Nishimura, President, Nihon Superior, shares his experience of the solder materials industry with EM Asia.

News

SIPLACE announces leadership changes in Asia

GOEPEL expands GATE partner program in Asia

Incap takes significant

Rohde & Schwarz has new President and CEO; enters oscilloscope market

Manufacturing Products & Equipment

ASSEMBLY TOOLS & EQUIPMENT: Cutting laser for depaneling

DISPENSING SYSTEMS: Rotary valve dispenser

IDENTIFICATION SYSTEMS: Code quality verifier

PICK & PLACE: High speed placement platform

SOFTWARE: Process data capture

SOLDERING MATERIALS: Terminal and wire training kit

T&M / INSPECTION:Sustainable inspection technology
T&M

Bringing ATE testing of PCB assemblies into the future
News Analysis

EMS providers to challenge ODMs in mobile PC market
News Snippets

Dymax expands operations to Korea

Henkel Asia: Price increase for adhesives

DEK extends commitment to lean

IMI to buy PSi Technologies

Multitest expands spare parts support in Asia

Avnet launches Asia-wide e-commerce site

News China

Enics to expand Beijing facility

Zestron expands technical support for North Asia

Flextronics to open new power facility in Ganzhou

Kyzen holds cleaning seminar at Nepcon West China 2010

Fitch: Rising wages pose risk to tech manufacturers in China
 
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