EMAsiaMag.com | Packaging & InterconnectCopyright 2007 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.ATE China 2010, the international event that focuses on industrial assembly machines and technologies in China, will open at Shenzhen Exhibition Center on August 31, 2010. It will exhibit state-of-the-art ....http://emasiamag.com/article-7521-atechina2010tokickoffnextweek-Asia.htmlElectronic components distributor Digi-Key Corporation and Harwin announced the two companies have entered into an agreement in which Digi-Key will distribute Harwin's products to customers worldwide. ....http://emasiamag.com/article-7506-digikeyandharwinsignglobaldistributionagreement-Asia.htmlPackage-on-package (PoP) component applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. A new ....http://emasiamag.com/article-7492-newwebsitededicatedtopackageonpackageassembly-Asia.htmlElectronic components distributor Digi-Key Corporation announced it has signed an expanded distribution agreement with Panasonic Electric Works Corporation of America. The expanded agreement will allow ....http://emasiamag.com/article-7384-digikeyandpanasonicelectricworksexpanddistributionagreementtoasiapacific-Asia.htmlIPC—Association Connecting Electronics Industries has released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry. This document provides comprehensive data to help users more ....http://emasiamag.com/article-7061-newrevisionofipc4202givesupdatedguidanceinflexiblebasedielectricmaterials-Asia.htmlBosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics announced that they have formed a consortium to jointly investigate and ....http://emasiamag.com/article-7063-semiconductorindustryleadersformda5consortiumtoexploreleadfreesolutions-Asia.htmlThe International Electronics Manufacturing Initiative (iNEMI) is organizing four new initiatives to address gaps in organic substrate technologies. These initiatives will focus on warpage (understanding ....http://emasiamag.com/article-7045-inemiorganizesfournewpackaginginitiatives-Asia.htmlIPC—Association Connecting Electronics Industries has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC said its most widely-used standard, which provides visual acceptance ....http://emasiamag.com/article-6937-ipca610ereleasedindustryrequirementsforacceptabilityofelectronicassembliesupdated-Asia.htmlPractical Components and Aim Solder announce they have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers’ ....http://emasiamag.com/article-6928-practicalcomponentsandaimsolderofferupdatedsolutionstoprintingchallenges-Asia.htmlNumerous companies in the electronics assembly and printed board industries will be making presentations at APEX 2010, scheduled to take place April 6-8, 2010 in Las Vegas, USA. They include: PCB Matrix ....http://emasiamag.com/article-6907-leadingcompaniestopresentatapex2010-Asia.html