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| News, Packaging & Interconnect - 09 Feb 2010 |
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| Weiner International Associates announces the appointment of John T (Jack) Fisher, said to be America’s leading electronic interconnect Technology Roadmap expert, as a Senior Associate. According to t... |
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| News, Packaging & Interconnect - 21 Jan 2010 |
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| Molex Incorporated has introduced its new SlimStack Board-to-Board series of connectors which have a 0.40mm pitch, 0.70mm mated height and 2.60mm width. According to the company, the new connectors of... |
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| News, Packaging & Interconnect - 08 Jan 2010 |
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| Innovex announced the appointment of Randy Acres as President, Chief Executive Officer and Director of the company, effective December 24, 2009. For the preceding 21 months, Acres held the position of... |
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| News, Packaging & Interconnect - 05 Nov 2009 |
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| Samsung Electronics Co Ltd announced that it has developed the "world’s thinnest" multi-die package, one that measures 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memor... |
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| News, Packaging & Interconnect - 30 Oct 2009 |
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| iNEMI annonuces that it will be sponsoring a packaging substrates workshop on November 17-18, 2009 at the Lucent Tower Conference Center in Nagoya, Japan. The purpose of this industry workshop is to i... |
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| News, Packaging & Interconnect - 06 Oct 2009 |
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| Molex Incorporated has released a whitepaper for design engineers, process engineers, product technicians and processing operators interested in applying solder charge technology, a new surface mount ... |
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| News, Packaging & Interconnect - 05 Oct 2009 |
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| Amkor Technology Inc announced that pursuant to the succession plan approved by the Board on June 25, 2009, James Kim, the company's Founder and former Chief Executive Officer, has become Executive Ch... |
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| News, Packaging & Interconnect - 15 Sep 2009 |
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| The International Electronics Manufacturing Initiative (iNEMI) is planning a two-day workshop to identify gaps and challenges related to organic substrate technology. The meeting will bring together l... |
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| News, Packaging & Interconnect - 14 Sep 2009 |
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| With a major order of more than €6 million for laser systems for manufacturing three dimensional cellphone antennae, LPKF announces the latest in a string of success reports released in recent months.... |
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| News, Packaging & Interconnect - 21 Aug 2009 |
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| Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology Inc with the 2009 Global Frost & Sullivan Technology Innovation of the Year Award... |
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